封装服务-Jiangsu Prosper Semiconductor INC.

Ceramic Vacuum Encapsulation

—— JPSI Semiconductor has a number of invention patents in the field of ultra-high vacuum and ultra-high temperature. With independent core technology, we provide customers with "a full range of vacuum sealing and testing services for ceramic packaging" to meet their one-stop needs.
——Ceramic packaging is the main packaging technology to meet the requirements of high reliability. Ceramics are used as packaging materials for IC chips because they are extremely stable in electrical, thermal, mechanical properties, etc., and their characteristics can be achieved by changing the control and adjustment of their chemical composition and process. They can not only be used as packaging materials, but also be important carrier substrates for various microelectronic products.

Metal package

—— JPSI has a number of invention patents in the field of ultra-high vacuum and ultra-high temperature. With independent core technology, we provide customers with "a full range of vacuum sealing and testing services for infrared thermal imaging metal packaging" to meet their one-stop needs.
——Metal packaging refers to an electronic packaging form in which metal is used as the main material of the tube shell, chips are directly or indirectly installed on the tube base through the substrate, and internal and external circuits are connected through leads. Because of its good mechanical strength, good thermal conductivity, electromagnetic shielding function and easy machining and other advantages, it was used in electronic packaging earlier, and is still the main material of electronic packaging today.

Wafer Level Packaging

—— JPSI Semiconductor has a number of invention patents in the field of ultra-high vacuum and ultra-high temperature. Provide customers with "infrared thermal imaging wafer level full series vacuum sealing test service" with independent core technology
—— JPSI can provide 1280x1024 high-level wafer level package

Film getter

Various mechanical sensors such as acceleration, angular velocity, pressure, etc. are suitable for optical RF sensors and have the advantage of miniaturization and high density. We are able to realize a package with good mechanical properties such as surface mounting. Ceramic lamination technology enables miniaturization, high density, and surface package.