Ceramic Vacuum Encapsulation

—— JPSI Semiconductor has a number of invention patents in the field of ultra-high vacuum and ultra-high temperature. With independent core technology, we provide customers with "a full range of vacuum sealing and testing services for ceramic packaging" to meet their one-stop needs.
——Ceramic packaging is the main packaging technology to meet the requirements of high reliability. Ceramics are used as packaging materials for IC chips because they are extremely stable in electrical, thermal, mechanical properties, etc., and their characteristics can be achieved by changing the control and adjustment of their chemical composition and process. They can not only be used as packaging materials, but also be important carrier substrates for various microelectronic products.