The technical team has more than 18 years of experience in Taiwanese packaging factories and is familiar with all kinds of packaging products.
Standardize the production process and strictly control the production yield of each process.
ODM or OEM can provide one-stop service. (Chip cutting, packaging, testing)
Experience in planning and design of automation equipment.

Deep accumulation of full process vacuum sealing process
Participate in the development of wafer fabrication array packaging process design
Experience in mass production covering all vacuum levels. (Low vacuum, high vacuum, ultra-high vacuum)