SIP packaging (system level packaging) is a packaging scheme that integrates multiple functional wafers, including processor, memory and other functional wafers into one package according to application scenarios, packaging substrate layers and other factors, so as to achieve a basically complete function.
Service Hotline：051262895811Hollow Airtight Construction
Excellent mechanical rigidity. The coefficient of thermal expansion is similar to that of silicon, so there is less stress with devices such as silicon MEMS.
Ceramic laminate technology facilitates miniaturization, high density, and surface packaging.
Acceleration sensor
Angular velocity sensor (gyroscope, transverse pendulum angle)
Pressure sensors
CMOS/CCD Image Sensor
Business Department Manager Zhou：18921110830
Marketing Manager Yan：17551035333
