Speciality

1) The packaging processing efficiency is high. It is manufactured by the batch production process in the form of wafers, which greatly improves the packaging efficiency by completing the packaging of the entire wafer chip at one time.

2) It has the advantages of flip chip packaging, namely light, thin, short and small. The package size is close to the chip size, and there is no limit on the height of the shell.

3) The IC design stage and packaging design of packaging chips can be considered uniformly and simultaneously, which will improve the design efficiency and reduce the design cost.

4) The equipment can make full use of wafer manufacturing equipment, without the need for back-end chip packaging production line construction.

5) Small package size and short lead lead bring better electrical performance.

6) When cutting into a single chip, the package structure or materials affect the scribing efficiency and the finished product rate.