IC packaging and testing is an essential part of the semiconductor industry chain, which is divided into packaging and testing segments. The global advanced packaging market will have an operating revenue of approximately US$31.5 billion in 2020; the advanced packaging market in China will reach US$4.6 billion in 2020, with a compound annual growth rate of 16%.
The rapid increase in domestic semiconductor design and foundry manufacturers has led to a shortage of advanced packaging and testing capacity.
In 2020, flip-chip (FLIP-CHIP) accounts for 81% of the advanced packaging market. Among the various advanced packaging platforms, 3D IC stacking and fan-out packages will grow at a rate of approximately 26%. Mobile and consumer applications account for 84% of the total advanced packaging market. It will account for 72% of the total advanced packaging by 2024. While in terms of revenue, telecom and infrastructure is the fastest growing segment in the advanced packaging market (~28%), its market share will grow from 6% in 2018 to 15% in 2024. Meanwhile, the automotive and transportation segment is expected to grow its market share from 9% in 2018 to 11% in 2024.

Semiconductor ( SEMICONDUCTOR ), refers to the conductive properties at room temperature between conductor ( CONDUCTOR ) and insulator ( INSULATOR ) material. Semiconductors have a wide range of applications in radios, televisions, and temperature measurement. For example, diodes are devices made of semiconductors. A semiconductor is a material whose conductivity can be controlled and can range from insulator to conductor. The importance of semiconductors is enormous, both from the point of view of technology and economic development. Most of today's electronic products, such as computers, cell phones or digital recorders in the core unit has a very close relationship with the semiconductor. Common semiconductor materials include silicon, germanium, gallium arsenide, etc., and silicon is the most influential one among all kinds of semiconductor materials in commercial applications.
Intrinsic semiconductor: A semiconductor without impurities and without lattice defects is called an intrinsic semiconductor. At very low temperatures, the valence band of a semiconductor is full band (see energy band theory), after being thermally excited, some of the electrons in the valence band will cross the forbidden band into the higher energy vacant band, which becomes the conduction band after the presence of electrons in the vacant band and forms a positively charged vacancy called a hole after the lack of an electron in the valence band. The hole conducting is not the actual movement, but an equivalent. When electrons conduct electricity the electrically equivalent holes move in their opposite direction . They produce directional motion under the action of external electric field and form macroscopic currents, called electron and hole conductivity, respectively. This mixed type of conductivity due to the generation of electron-hole pairs is called intrinsic conductivity. The electrons in the conduction band fall into the holes and the electron-hole pairs disappear, which is called compounding. The energy released during compounding becomes electromagnetic radiation (luminescence) or thermal vibrational energy of the lattice (heat generation). At a certain temperature, electron-hole pair generation and compounding exist simultaneously and reach dynamic equilibrium, when the semiconductor has a certain carrier density and thus a certain resistivity. When the temperature increases, more electron-hole pairs are produced, the carrier density increases, and the resistivity decreases. Pure semiconductors without lattice defects have higher resistivity and are not used much in practice.
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