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Participate in the development of wafer fabrication array packaging process design
Participate in the development of wafer fabrication array packaging process design
IC packaging and testing is an essential part of the semiconductor industry chain, which is divided into packaging and testing segments. The global advanced packaging market will have an operating revenue of approximately US$31.5 billion in 2020; the advanced packaging market in China will reach US$4.6 billion in 2020, with a compound annual growth rate of 16%.
The rapid increase in domestic semiconductor design and foundry manufacturers has led to a shortage of advanced packaging and testing capacity.
In 2020, flip-chip (FLIP-CHIP) accounts for 81% of the advanced packaging market. Among the various advanced packaging platforms, 3D IC stacking and fan-out packages will grow at a rate of approximately 26%. Mobile and consumer applications account for 84% of the total advanced packaging market. 72% of the total advanced packaging by 2024...
09-18
Participate in the development of wafer fabrication array packaging process design
Participate in the development of wafer fabrication array packaging process design
Participate in the development of wafer fabrication array packaging process design
IC packaging and testing is an essential part of the semiconductor industry chain, which is divided into packaging and testing segments. The global advanced packaging market will have an operating revenue of approximately US$31.5 billion in 2020; the advanced packaging market in China will reach US$4.6 billion in 2020, with a compound annual growth rate of 16%.
The rapid increase in domestic semiconductor design and foundry manufacturers has led to a shortage of advanced packaging and testing capacity.
In 2020, flip-chip (FLIP-CHIP) accounts for 81% of the advanced packaging market. Among the various advanced packaging platforms, 3D IC stacking and fan-out packages will grow at a rate of approximately 26%. Mobile and consumer applications account for 84% of the total advanced packaging market. 72% of the total advanced packaging by 2024...
09-18
Participate in the development of wafer fabrication array packaging process design
Participate in the development of wafer fabrication array packaging process design
Participate in the development of wafer fabrication array packaging process design
IC packaging and testing is an essential part of the semiconductor industry chain, which is divided into packaging and testing segments. The global advanced packaging market will have an operating revenue of approximately US$31.5 billion in 2020; the advanced packaging market in China will reach US$4.6 billion in 2020, with a compound annual growth rate of 16%.
The rapid increase in domestic semiconductor design and foundry manufacturers has led to a shortage of advanced packaging and testing capacity.
In 2020, flip-chip (FLIP-CHIP) accounts for 81% of the advanced packaging market. Among the various advanced packaging platforms, 3D IC stacking and fan-out packages will grow at a rate of approximately 26%. Mobile and consumer applications account for 84% of the total advanced packaging market. 72% of the total advanced packaging by 2024...
09-18
Participate in the development of wafer fabrication array packaging process design
Participate in the development of wafer fabrication array packaging process design
Participate in the development of wafer fabrication array packaging process design
IC packaging and testing is an essential part of the semiconductor industry chain, which is divided into packaging and testing segments. The global advanced packaging market will have an operating revenue of approximately US$31.5 billion in 2020; the advanced packaging market in China will reach US$4.6 billion in 2020, with a compound annual growth rate of 16%.
The rapid increase in domestic semiconductor design and foundry manufacturers has led to a shortage of advanced packaging and testing capacity.
In 2020, flip-chip (FLIP-CHIP) accounts for 81% of the advanced packaging market. Among the various advanced packaging platforms, 3D IC stacking and fan-out packages will grow at a rate of approximately 26%. Mobile and consumer applications account for 84% of the total advanced packaging market. 72% of the total advanced packaging by 2024...
09-18
Participate in the development of wafer fabrication array packaging process design
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